Polymatech Inks Deal with Japan’s Orbray, Aims to Become End-to-End Chipmaker in India – News18

Polymatech Electronics, India’s pioneer in opto-semiconductor chips, has inked a Memorandum of Understanding (MoU) with Japanese agency Orbray Co. Ltd, marking a pivotal step within the firm’s imaginative and prescient to evolve right into a “fully integrated, end-to-end semiconductor company”.

However, the partnership entails a complete change, as Orbray will present coaching to Polymatech Electronics engineers at its state-of-the-art facility in Japan. Furthermore, the Indian firm has additionally finalised the procurement of sapphire ingot rising and wafer fabrication equipment, slated for set up by March 2025 at its Chennai facility.

Sapphire ingot know-how is the method of rising massive, high-quality crystals of sapphire (aluminium oxide) to be used within the semiconductor business.

Eswara Rao Nandam, Managing Director & CEO of Polymatech Electronics, remarked, “This is a historic day for us as we move closer to our company’s vision of becoming a ‘fully integrated, end-to-end semiconductor company’. This MoU will enable us to progress towards converting ingot into products, thereby entering the next level of our growth story.”

Orbray, an 85-year-old Japanese precision parts producer famend globally, brings to the desk a wealth of experience in optical fibre parts, Sapphire Wafers, and micro-motors, working throughout varied vegetation worldwide.

As of now, Polymatech Electronics has been India’s sole developer, producer, and packager of opto-semiconductor chips since 2019. Opto-semiconductor chips are tiny digital gadgets that may both emit or detect gentle. They are constituted of particular supplies, like silicon or germanium, which may conduct electrical energy and work together with gentle in distinctive methods. There are two primary varieties of opto-semiconductor chips, light-emitting diodes (LEDs), the place the Tamil Nadu firm has the main focus, and light-detecting gadgets.

With an increasing clientele spanning the US, EU, and MENA international locations, the corporate boasts a present manufacturing capability of two,000 million chips. Polymatech Electronics manufactures these chips at its Oragadam, Tamil Nadu facility and has exported greater than $125 million within the fiscal 12 months 2023-24.

Polymatech Electronics makes a speciality of designing, manufacturing, packaging, and assembling semiconductor chips and chip modules catering to various functions, together with medical, agriculture, large-area lighting, PCs, laptops, and cellular phone backlights.

Nandam stated: “This is a considerable investment, and we will apply with the Government of India for capital subsidy under applicable schemes and respective state governments. Polymatech Electronics previously signed an MoU with the Government of Tamil Nadu on 27 May 2020.”

“We are also in advanced discussions with Silicon Carbide Wafer and Silicon Wafer fabrication machinery suppliers to accelerate our plans to become multi-wafer producers. As part of Polymatech Electronics initiative to make high-end semiconductor chips, we will supply all these wafers to companies entering the Indian market for packaging and other businesses,” he added.